- 专利标题： CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
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申请号： US18547066申请日： 2022-02-08
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公开(公告)号： US20240141094A1公开(公告)日： 2024-05-02
- 发明人: Kohei HIRAYAMA , Keisuke OTA , Ryo OGAWA , Shinsuke YAMADA
- 申请人： ADEKA CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： ADEKA CORPORATION
- 当前专利权人： ADEKA CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP 21036705 2021.03.08
- 国际申请： PCT/JP2022/004965 2022.02.08
- 进入国家日期： 2023-08-18
- 主分类号： C08G59/24
- IPC分类号： C08G59/24 ; C08G59/28 ; C08G59/34 ; C08G59/50 ; C08G59/56 ; C08K3/08 ; C08K3/36 ; C08L61/14 ; C09J163/08
摘要：
A curing resin composition including (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen-containing amine latent curing agent, and (D) an ion scavenger. The cyanate ester resin (A) is preferably at least one of a compound of formula (1) below, a compound of formula (2) below, and a polymer of at least one of these compounds (1) and (2).
NC—O-A1-Y1-A2-O—CN (1)
wherein the symbols are as defined in the description.
wherein the symbols are as defined in the description.
NC—O-A1-Y1-A2-O—CN (1)
wherein the symbols are as defined in the description.
wherein the symbols are as defined in the description.
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