A lens module with reduced height, and an electronic device carrying it, includes a lens assembly, a printed circuit board, a filter, and a photosensitive chip. The first and second opposing surfaces of the printed circuit board are each grooved to respectively hold the filter and the photosensitive chip. The existence of the first and second grooves enables a significant reduction to be made in the total height of the lens module. Moreover, the lens module adopts the FC packaging structure, not requiring a bracket, to further reduce the volume of the lens module.