The present invention provides an electronic component sealing lid that suppresses detachment caused by reflow treatment, wherein the sealing lid is formed from a resin composition containing a liquid crystal polymer and an inorganic substance, and satisfies either the following formula (a) or formula (b). (a): T1/T2 1.1 [wherein T1=S1/S2, T2=S3/S4, S1 is the area of the region obtained by connecting, with a straight line, the inverse peak nearest to 900 cm−1 and the inverse peak nearest to 860 cm−1 in the absorbance distribution of the bonding surface of the lid, S2 is the area of the region obtained by connecting, with a straight line, the inverse peak nearest to 900 cm−1 and the inverse peak nearest to 770 cm−1 in the absorbance distribution of the bonding surface of the lid, S3 is the area of the region obtained by connecting, with a straight line, the inverse peak nearest to 900 cm−1 and the inverse peak nearest to 860 cm−1 in the absorbance distribution of the portion of the lid that is not the bonding surface, and S4 is the area of the region obtained by connecting, with a straight line, the inverse peak nearest to 900 cm−1 and the inverse peak nearest to 770 cm−1 in the absorbance distribution of the portion of the lid that is not the bonding surface].