In an embodiment an optoelectronic semiconductor component includes a layer stack having a side face or a plurality of side faces including a first side region delimiting a first semiconductor region sideways and a second side region partially delimiting a second side region sideways and a first main face and a second main face lying opposite the first main face, the one or more side faces connecting the first main face and the second main face to one another. The component further includes a first contact configured for electrical contacting the first semiconductor region, a second contact configured for the electrical contacting of the second semiconductor region and a dielectric layer arranged between the second contact and the layer stack, wherein the second contact is configured for horizontal current injection into the second semiconductor region.