- 专利标题: BINDING AGENTS FOR ELECTROCHEMICALLY ACTIVE MATERIALS AND METHODS OF FORMING THE SAME
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申请号: US18407031申请日: 2024-01-08
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公开(公告)号: US20240145686A1公开(公告)日: 2024-05-02
- 发明人: David Lee , Xiaohua Liu , Monika Chhorng , Jeff Swoyer , Benjamin Yong Park , Rahul Kamath
- 申请人: Enevate Corporation
- 申请人地址: US CA Irvine
- 专利权人: Enevate Corporation
- 当前专利权人: Enevate Corporation
- 当前专利权人地址: US CA Irvine
- 主分类号: H01M4/36
- IPC分类号: H01M4/36 ; C03C3/04 ; C04B35/52 ; C04B35/524 ; H01G11/30 ; H01G11/32 ; H01G11/58 ; H01G11/64 ; H01M4/13 ; H01M4/133 ; H01M4/134 ; H01M4/1393 ; H01M4/1395 ; H01M4/38 ; H01M4/485 ; H01M4/58 ; H01M4/587 ; H01M4/62 ; H01M4/66 ; H01M10/0525 ; H01M10/0562 ; H01M10/0567
摘要:
In some embodiments, an electrode can include a current collector, a composite material in electrical communication with the current collector, and at least one phase configured to adhere the composite material to the current collector. The current collector can include one or more layers of metal, and the composite material can include electrochemically active material. The at least one phase can include a compound of the metal and the electrochemically active material. In some embodiments, a composite material can include electrochemically active material. The composite material can also include at least one phase configured to bind electrochemically active particles of the electrochemically active material together. The at least one phase can include a compound of metal and the electrochemically active material.
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