Invention Publication
- Patent Title: INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR
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Application No.: US18499044Application Date: 2023-10-31
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Publication No.: US20240147605A1Publication Date: 2024-05-02
- Inventor: Xingyu CHENG , Shota YAMADA , Takafumi SUGAWARA , Nobuhiro TAMAI
- Applicant: Hirose Electric Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: Hirose Electric Co., Ltd.
- Current Assignee: Hirose Electric Co., Ltd.
- Current Assignee Address: JP Yokohama
- Priority: JP 22175317 2022.11.01
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01R13/6469

Abstract:
The intermediate circuit board has a plate-shaped substrate and a plurality of signal transmission line pairs for differential signal transmission extending on a major face of the substrate from one end to the other end of the substrate in the direction of connection to the counterpart connect bodies; the substrate has a fiber cloth formed by braiding a plurality of fibers used to reinforce the substrate in a mesh pattern and a plate-like member made of plastic having the fiber cloth embedded therein; the plurality of signal transmission line pairs have straight pairs and cross pairs disposed in an alternating manner in the width direction of the substrate; and the straight pairs and cross pairs, when viewed in the through-thickness direction of the substrate, are formed extending inclined at an angle relative to the fibers of the fiber cloth.
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