A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.