- 专利标题: Helical Wrap For Stent Wire Attachment
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申请号: US18503891申请日: 2023-11-07
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公开(公告)号: US20240148526A1公开(公告)日: 2024-05-09
- 发明人: Ponaka Pung
- 申请人: MicroVention, Inc.
- 申请人地址: US CA Aliso Viejo
- 专利权人: MicroVention, Inc.
- 当前专利权人: MicroVention, Inc.
- 当前专利权人地址: US CA Aliso Viejo
- 主分类号: A61F2/90
- IPC分类号: A61F2/90 ; A61L31/02
摘要:
A vascular implant may comprise at least a first layer having one or more drawn fill tube wires (DFT wires) and at least a second layer having one or more non-DFT wires. The first layer may be braided from only a single DFT wire, and the second layer may be braided from a plurality of non-DFT wire. A vascular implant may also include a connecting wire composed of a shape memory alloy and that is shape set prior to connection to one or more implant layers composed of DFT wires.
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