Invention Publication
- Patent Title: HEEL CLAMP FOR FOOTWEAR SOLE ARRANGEMENT
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Application No.: US18414449Application Date: 2024-01-16
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Publication No.: US20240148601A1Publication Date: 2024-05-09
- Inventor: Shahriar Behnamian
- Applicant: Shahriar Behnamian
- Applicant Address: US DC Washington
- Assignee: ANTEPES, LLC
- Current Assignee: ANTEPES, LLC
- Current Assignee Address: US DC Washington
- Main IPC: A61H15/00
- IPC: A61H15/00

Abstract:
A heel clamp, or posterior component, for an article of footwear is provided. The heel clamp may comprise a posterior component height value measuring a height value from a lowest point under the heel of the foot on an upper facing surface to a top of the posterior component. A lateral component and a medial component of the heel clamp may include a predetermined height value or an extension height value. The lateral component may be extending into or through an area in-between a lateral malleolus bone of the foot and an Achilles tendon of the foot, the medial component may be extending into or through an area in-between a medial malleolus bone of the foot and the Achilles tendon of the foot, and the intermediate component may be extending to an area of an end of a top of a calcaneus bone of the foot.
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