Invention Publication
- Patent Title: MOLDING DEVICE
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Application No.: US18412925Application Date: 2024-01-15
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Publication No.: US20240149323A1Publication Date: 2024-05-09
- Inventor: Kei YAMAUCHI , Eiji KOUYAMA , Hiroyuki KAN , Norieda UENO
- Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP 21152045 2021.09.17
- Main IPC: B21D26/041
- IPC: B21D26/041 ; B21D26/039
Abstract:
A molding device supplies a fluid and performs expansion molding of a metal material using at least a part of members of an existing press device.
Information query
