Invention Publication
- Patent Title: INTELLIGENT BMC-BASED ON-DEVICE AI INTERWORKING METHOD
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Application No.: US18387230Application Date: 2023-11-06
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Publication No.: US20240160963A1Publication Date: 2024-05-16
- Inventor: Jae Hoon AN , Young Hwan KIM , Han Gyeol KIM
- Applicant: Korea Electronics Technology Institute
- Applicant Address: KR Seongnam-si
- Assignee: Korea Electronics Technology Institute
- Current Assignee: Korea Electronics Technology Institute
- Current Assignee Address: KR Seongnam-si
- Priority: KR 20220150068 2022.11.11
- Main IPC: G06N5/04
- IPC: G06N5/04

Abstract:
There is provided an intelligent BMC for predicting a fault by interworking on-device AI. A fault prediction method of a BMC according to an embodiment includes: collecting monitoring information regarding computing modules installed on a main board; calculating a FOFL from the collected monitoring data; and constructing an AI model related to the calculated FOFL and predicting a FOFL from the monitoring data. Accordingly, a fault occurring in various patterns may be predicted based on monitoring data by interworking with on-device AI.
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