Invention Publication
- Patent Title: THERMAL CONDUCTOR
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Application No.: US18551124Application Date: 2022-03-07
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Publication No.: US20240167772A1Publication Date: 2024-05-23
- Inventor: Hideki MORIUCHI
- Applicant: TOMOEGAWA CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOMOEGAWA CO., LTD.
- Current Assignee: TOMOEGAWA CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP 21052418 2021.03.25
- International Application: PCT/JP2022/009673 2022.03.07
- Date entered country: 2023-09-18
- Main IPC: F28F3/02
- IPC: F28F3/02 ; F28F3/04
Abstract:
A thermal conductor (10) includes: a thermal-conduction portion (20) including metal; and a protrusion (30) attached to a surface of the thermal-conduction portion (20) and extending from the thermal-conduction portion (20), wherein the protrusion (30) includes a core (32) made of a metal bulk body, and a metal fiber structure (34) fusion-bonded around the core (32).
Information query
