Invention Publication
- Patent Title: SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERS USING THE COMPOSITION
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Application No.: US18484313Application Date: 2023-10-10
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Publication No.: US20240168375A1Publication Date: 2024-05-23
- Inventor: Minyoung LEE , Seung HAN , Sangkyun IM , Jimin KIM , Yaeun SEO , Gyeong Ryeong BAK
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si
- Priority: KR 20220145387 2022.11.03
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07F7/22
Abstract:
A semiconductor photoresist composition including an organometallic compound, an additive represented by Chemical Formula 1, and a solvent, and a method of forming uses the semiconductor photoresist composition. Details of Chemical Formula 1 are as defined in the specification.
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