Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US18471581Application Date: 2023-09-21
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Publication No.: US20240170567A1Publication Date: 2024-05-23
- Inventor: RYOTA SUZUKI
- Applicant: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA , MIRISE Technologies Corporation
- Applicant Address: JP Kariya-city
- Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee Address: JP Kariya-city
- Priority: JP 22184657 2022.11.18
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/16
Abstract:
A semiconductor device includes lower guard rings and upper guard rings. An upper portion of each of the lower guard rings overlaps a lower portion of the corresponding upper guard ring. A lower inner peripheral surface of each of the lower guard rings is offset to one side in a predetermined direction with respect to an upper inner peripheral surface of the corresponding upper guard ring. A lower outer peripheral surface of each of the lower guard rings is offset to the one side in the predetermined direction with respect to an upper outer peripheral surface of the corresponding upper guard ring.
Information query
IPC分类:
