- 专利标题： ROBOT FOR HANDLING FLAT SUBSTRATES AS WELL AS ALIGNMENT FACILITY
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申请号： US18551649申请日： 2022-06-15
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公开(公告)号： US20240178045A1公开(公告)日： 2024-05-30
- 发明人: Uwe BEIER
- 申请人： Uwe BEIER
- 申请人地址： DE Ottendorf-Okrilla
- 专利权人： Uwe BEIER
- 当前专利权人： Uwe BEIER
- 当前专利权人地址： DE Ottendorf-Okrilla
- 优先权： DE 2021115853.2 2021.06.18
- 国际申请： PCT/DE2022/100447 2022.06.15
- 进入国家日期： 2023-09-21
- 主分类号： H01L21/687
- IPC分类号： H01L21/687 ; B25J11/00 ; H01L21/677
摘要：
A robot for handling flat substrates having one or more substrate holder(s), each substrate holder is for horizontally holding respectively one of the substrates, a carrier block holding the substrate holder or if several substrate holders are provided holding the substrate holders spaced from each other, and a robot arm. The carrier block is attached to the robot arm by an alignment facility, and the alignment facility is for aligning the carrier block.
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