An electronic device includes a multilevel package substrate, a semiconductor die, and a molded package structure, where the multilevel package substrate has opposite first and second substrate sides, first and second conductive pads spaced apart from one another along the first substrate side, and a conductive substrate terminal that is exposed along the second substrate side and is electrically coupled to the second conductive pad. The semiconductor die is attached to the first substrate side and has opposite first and second die sides, and a die terminal along the first die side, the die terminal electrically coupled to the first conductive pad. The molded has a package side, a metal shield along the package side, and a conductive package via that extends through the molded package structure and electrically couples the metal shield to the second conductive pad.