发明公开
- 专利标题: COIL COMPONENT
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申请号: US18383174申请日: 2023-10-24
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公开(公告)号: US20240194394A1公开(公告)日: 2024-06-13
- 发明人: Ye Ji JUNG , Jae Hun KIM , Ju Hwan YANG , In Young KANG , Boum Seock KIM
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 优先权: KR 20220170018 2022.12.07
- 主分类号: H01F27/29
- IPC分类号: H01F27/29 ; H01F5/04
摘要:
A coil component includes a body, a support member, a first coil including a first coil portion disposed on one surface of the support member and having one end and the other end being a first lead-out portion and a first connection portion, respectively, a sub-lead-out portion disposed on the other surface of the support member, and a first via connecting the first lead-out portion and the sub-lead-out portion, a second coil disposed on the other surface of the support member and including a second coil portion having one end and the other end being a second lead-out portion and a second connection portion, respectively, and a second via connecting the first and second connection portions, wherein the first via has a diameter greater than a diameter of the second via.
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