Invention Publication
- Patent Title: CUT SURFACE SMOOTHING DEVICE AND MANUFACTURING SYSTEM
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Application No.: US18286559Application Date: 2022-03-04
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Publication No.: US20240200262A1Publication Date: 2024-06-20
- Inventor: Akira MIZUNO
- Applicant: airweave inc.
- Applicant Address: JP Aichi
- Assignee: airweave inc.
- Current Assignee: airweave inc.
- Current Assignee Address: JP Aichi
- Priority: JP 21069053 2021.04.15
- International Application: PCT/JP2022/009385 2022.03.04
- Date entered country: 2023-11-23
- Main IPC: D06M23/14
- IPC: D06M23/14 ; D06M13/53
Abstract:
A cut surface smoothing device which can smooth the cut surface of a filament three-dimensional bonded member is provided. The cut surface smoothing device includes a high temperature portion which is heated to a temperature equal to or higher than the melting point of the filament three-dimensional bonded member, and the high temperature portion is applied to the cut surface of the filament three-dimensional bonded member to smooth the cut surface.
Information query
