Invention Publication
- Patent Title: COIL COMPONENT
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Application No.: US18538666Application Date: 2023-12-13
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Publication No.: US20240212923A1Publication Date: 2024-06-27
- Inventor: Soon Kwang Kwon , Dong Hwan Lee , Boum Seock Kim , Jung Wook Seo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220180365 2022.12.21
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/32

Abstract:
The coil component according to an aspect of the present disclosure includes: a body having one surface and the other surface opposing each other, and a plurality of side surfaces connecting one side to the other side; a coil buried in the body and having an end exposed to the side surface of the body; an external electrode including a connection portion disposed on the side surface of the body and connected to the end of the coil, and an extension portion extending from the connection portion to one surface of the body; and a groove formed in one surface of the body and having a bottom surface, substantially parallel to one surface of the body, and an internal wall connecting the bottom surface to one surface of the body, wherein the extension portion extends along the internal wall and the bottom surface of the groove.
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