A light-emitting substrate includes a substrate, a first metal layer, a first insulating layer, a second metal layer and a conductive adhesive. A bonding region is proximate to a selected side edge of a first surface of the substrate. The first metal layer on the first surface includes first bonding electrodes. The first insulating layer is on the first metal layer, and a border thereof proximate to the edge is closer to the edge than a border of the first bonding electrodes facing the edge. The second metal layer includes second bonding electrodes. The conductive adhesive in the bonding region covers portions of the second bonding electrodes. A ratio of a dimension of an edge portion of the first insulating layer in a second direction to a dimension of a first bonding electrode in same direction is greater than or equal to ⅕ and less than or equal to ½.