- 专利标题: MODULAR ELECTRICAL WIRING DEVICE PLATFORM AND ASSEMBLIES
-
申请号: US18397070申请日: 2023-12-27
-
公开(公告)号: US20240222949A1公开(公告)日: 2024-07-04
- 发明人: Richard M. Rohmer
- 申请人: Pass & Seymour, Inc.
- 申请人地址: US NY Syracuse
- 专利权人: Pass & Seymour, Inc.
- 当前专利权人: Pass & Seymour, Inc.
- 当前专利权人地址: US NY Syracuse
- 主分类号: H02G3/10
- IPC分类号: H02G3/10 ; H01R13/04 ; H01R13/11 ; H01R13/713 ; H01R13/74 ; H01R25/00 ; H02G3/14 ; H02G3/18
摘要:
A powered subplate device, the device including a front face and a rear face. The front face includes a recessed portion extending from the front face toward the back face, where the recessed portion is configured to receive an electrical wiring device, and the recessed portion includes one or more receptacle terminals. The one or more receptacle terminals extend perpendicular to the front face, where a rear facing end of the one or more receptacle terminals are configured to connect to AC wires on the rear face of the powered subplate. The front facing end of the one or more receptacle terminals are configured to mate with plug blades of the electrical wiring device.
信息查询
IPC分类: