- 专利标题: Electronic Component And Method For Manufacturing Electronic Component
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申请号: US18535085申请日: 2023-12-11
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公开(公告)号: US20240234009A9公开(公告)日: 2024-07-11
- 发明人: Shinichi SAKAMOTO , Zhigang CHENG , Fernando CHAN MOCK , Mitsugu KAWARAI
- 申请人: SUMIDA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: SUMIDA CORPORATION
- 当前专利权人: SUMIDA CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: CN 1310109345.6 2013.03.29 CN 1410050474.7 2014.02.13
- 分案原申请号: US17374365 2021.07.13
- 主分类号: H01F27/28
- IPC分类号: H01F27/28 ; H01F27/24 ; H01F27/29 ; H01F27/30 ; H01F41/02 ; H01F41/04 ; H01F41/061
摘要:
An electronic component comprises: a magnetic core having a flat base and a core, the flat base having a top, a bottom, and first and second opposite sides, the core is on the top; a winding having an edgewise coil including a wound flat wire and the core, the winding having two non-wound flat wires extending therefrom; and a magnetic exterior body covering the core and the edgewise coil. The two non-wound flat wires extend along the top, the first side, the bottom and then the second side, and the two non-wound flat wires are non-adhesively positioned around the flat base. The two non-wound flat wires on the bottom are externally exposed electrodes. The second side inclines towards the core. The two ends of the two non-wound flat wires are embedded into the magnetic exterior body to fix the two non-wound flat wires to the magnetic exterior body.
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