Invention Publication
- Patent Title: COOLING SYSTEM FOR POWER ELECTRONICS
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Application No.: US18405259Application Date: 2024-01-05
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Publication No.: US20240237313A1Publication Date: 2024-07-11
- Inventor: Arindom Joardar , Tobias Sienel
- Applicant: Carrier Corporation
- Applicant Address: US FL Palm Beach Gardens
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: US FL Palm Beach Gardens
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cooling system for cooling one or more heat-generating devices includes a heat sink to which the one or more heat-generating devices are thermally coupled and a heat exchanger thermally coupled to the heat sink. The heat exchanger has a first flow path for receiving a primary cooling fluid and a second flow path for receiving a secondary cooling fluid. Heat is transferable to the primary cooling fluid from both the heat sink and the secondary cooling fluid at the heat exchanger.
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