- 专利标题： OPTIMISED STRUCTURE FOR REGULATING HEAT VIA HEAT PIPE FOR ELECTRONIC EQUIPMENT SUPPORT PANELS
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申请号： US18564970申请日： 2022-05-31
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公开(公告)号： US20240239521A1公开(公告)日： 2024-07-18
- 发明人: Barbara MABED , Marc BEKEMANS
- 申请人： SONACA S.A.
- 申请人地址： BE GOSSELIES
- 专利权人： SONACA S.A.
- 当前专利权人： SONACA S.A.
- 当前专利权人地址： BE GOSSELIES
- 优先权： BE 215435 2021.05.31
- 国际申请： PCT/EP2022/064768 2022.05.31
- 进入国家日期： 2023-11-28
- 主分类号： B64G1/50
- IPC分类号： B64G1/50 ; H05K7/20
摘要：
A profile section for an equipment support panel. The profile section is formed in one piece, comprising a tube suitable for forming a heat pipe by introducing and confining a heat-transfer fluid inside of same, and a groove provided to form a rail along its length for securing at least one piece of equipment supported by the panel, this groove being shaped to form-fittingly engage with an attachment member rigidly connected to the at least one piece of equipment.
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