Invention Publication
- Patent Title: THERMALLY-ENHANCED AEROSOL FORMING SUBSTRATE
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Application No.: US18576782Application Date: 2022-07-07
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Publication No.: US20240245097A1Publication Date: 2024-07-25
- Inventor: Houxue Huang , Esther Wairimu
- Applicant: PHILIP MORRIS PRODUCTS S.A.
- Applicant Address: CH Neuchatel
- Assignee: PHILIP MORRIS PRODUCTS S.A.
- Current Assignee: PHILIP MORRIS PRODUCTS S.A.
- Current Assignee Address: CH Neuchatel
- Priority: EP 184365.1 2021.07.07 EP 178772.4 2022.06.13
- International Application: PCT/EP2022/068955 2022.07.07
- Date entered country: 2024-01-05
- Main IPC: A24B15/42
- IPC: A24B15/42 ; A24B15/12 ; A24B15/28 ; A24D1/20

Abstract:
An aerosol-forming substrate comprises a first material and a second material, the first material being comprised in the aerosol-forming substrate as a first plurality of discrete elements and the second material being comprised in the aerosol-forming substrate as a second plurality of discrete elements. The first material comprises an aerosol-former and has a first thermal conductivity, and the second material has a second thermal conductivity that is greater than the first thermal conductivity. The presence of the discrete elements of the second material in the aerosol-forming substrate produces a substrate with augmented thermal conductivity resulting in improvements in aerosol generation and delivery.
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