- 专利标题: TEST SYSTEM FOR EVALUATING THERMAL PERFORMANCE OF A HEATSINK
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申请号: US18624470申请日: 2024-04-02
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公开(公告)号: US20240248005A1公开(公告)日: 2024-07-25
- 发明人: Phu TRUONG , Attila I. ARANYOSI , Vu L. LE
- 申请人: Juniper Networks, Inc
- 申请人地址: US CA Sunnyvale
- 专利权人: Juniper Networks, Inc
- 当前专利权人: Juniper Networks, Inc
- 当前专利权人地址: US CA Sunnyvale
- 分案原申请号: US17515762 2021.11.01
- 主分类号: G01M99/00
- IPC分类号: G01M99/00 ; G01K1/143 ; G01K7/02
摘要:
A probe assembly for a test fixture for a heatsink, may include a thermocouple probe configured to measure a surface temperature of the heatsink. The probe assembly may include a base portion with an opening for receiving the thermocouple probe. The probe assembly may include a spring-loaded collet assembly connected to the thermocouple probe via the opening of the base portion and configured to cause the thermocouple probe to removably contact a bottom surface of a pedestal of the heatsink. The probe assembly may include a thermocouple cable connected to the thermocouple probe and configured to communicate the surface temperature of the heatsink.
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