Invention Publication
- Patent Title: FINGERPRINT IDENTIFICATION MODULE
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Application No.: US18016905Application Date: 2022-02-23
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Publication No.: US20240249550A1Publication Date: 2024-07-25
- Inventor: Xin LIU , Chen MENG , Jiaqiang WANG , Ziyan LI
- Applicant: Beijing BOE Optoelectronics Technology Co., Ltd. , BOE Technology Group Co. Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co. Ltd.
- Current Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co. Ltd.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2022/077525 2022.02.23
- Date entered country: 2023-01-19
- Main IPC: G06V40/13
- IPC: G06V40/13 ; H05K5/00

Abstract:
A fingerprint identification module provided by the present disclosure includes a fingerprint identification panel provided with a fingerprint identification region; a middle shell including a partition plate and a middle frame, where the partition plate is at a side opposite a fingerprint identification side of the fingerprint identification panel, the partition plate is detachably connected to the middle frame, and the middle frame includes an accommodation space, the accommodation space being internally provided with the partition plate and the fingerprint identification panel; and a main board in the accommodation space, the main board being at a side, far away from the fingerprint identification panel, of the partition plate, and the main board being electrically connected to the fingerprint identification panel.
Public/Granted literature
- US12198463B2 Fingerprint identification module Public/Granted day:2025-01-14
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