Invention Publication
- Patent Title: SIDELINK COMMUNICATION USING A MULTIPLE-SLOT UNIT
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Application No.: US18508564Application Date: 2023-11-14
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Publication No.: US20240260057A1Publication Date: 2024-08-01
- Inventor: Chih-Hao LIU , Xiaoxia ZHANG , Jing SUN , Giovanni CHISCI
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04W72/25
- IPC: H04W72/25 ; H04L27/26 ; H04W72/0446

Abstract:
Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive an indication of a multiple-slot unit structure that is to be used for sidelink communication, the multiple-slot unit structure having multiple contiguous slots that include, in sequence, a first time interval for automatic gain control, a second time interval for at least one of sidelink control communication or sidelink data communication, and a third time interval providing a time gap for transmission-reception switching. The UE may communicate, on a sidelink, in one or more multiple-slot units that are in accordance with the multiple-slot unit structure. Numerous other aspects are described.
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