- 专利标题: CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BACKPLATE,BACKLIGHT MODULE AND DISPLAY APPARATUS
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申请号: US18017902申请日: 2022-02-24
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公开(公告)号: US20240260185A1公开(公告)日: 2024-08-01
- 发明人: Jiaxiang Zhang , Nianqi Yao , Ke Wang
- 申请人: BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing
- 国际申请: PCT/CN2022/077542 2022.02.24
- 进入国家日期: 2023-01-25
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H01L21/48 ; H01L23/498 ; H01L25/075 ; H01L25/16 ; H01L27/12 ; H05K1/09 ; H05K1/18 ; H05K3/06
摘要:
A circuit board and a method for manufacturing the circuit board, a functional backplate, a backlight module, a display apparatus, and a display panel are provided. The circuit board includes: a base substrate; a wire arranged on the base substrate, where the wire includes a first conductive layer; and at least one insulating layer arranged on a side of the first conductive layer away from the base substrate, where the at least one insulating layer covers the first conductive layer. The first conductive layer includes a first stacked structure on a side away from the base substrate and a second stacked structure proximate to the base substrate, and the first stacked structure includes at least an etch stop layer covering the second stacked structure.
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