Embodiments of this application provide a foldable electronic device, including a shaft cover, a device body, and a first swing arm; a second swing arm coupled to a damping component inside the shaft cover and distributed in parallel to the first swing arm; and a pin connecting the first swing arm and the second swing arm so that the second swing arm follows the first swing arm to rotate and transmits a damping force produced by the damping component to the first swing arm through the pin. In the electronic device according to the embodiments of this application, fitting between the annular groove and the boss increases a sectional area of a joint between the first swing arm and the second swing arm and reduces shear stress experienced by the pin, avoiding fracture of the pin under undesirably large shear stress, thereby improving reliability of the device.