An array substrate is provided. The array substrate includes a plurality of bonding pins in a bonding pin area. A respective bonding pin of the plurality of bonding pins is a stacked structure comprising N number of metal sub-layers sequentially arranged on a base substrate, a first metal sub-layer of the N number of metal sub-layers being on a side of an N-th metal sub-layer of the N number of metal sub-layers closer to the base substrate, the N-th metal sub-layer being a last metal sub-layer of the respective bonding pin, N is an integer≥2. In a first cross-section along a plane perpendicular to the base substrate, parallel to at least one of two lateral sides, and intersecting the N number of metal sub-layers of the respective bonding pin, any of the first metal sub-layer to an (N−1)-th metal sub-layer of the respective bonding pin are completely unexposed.