Invention Publication
- Patent Title: UNIFYING MULTIPLE AUDIO BUS INTERFACES IN AN AUDIO SYSTEM
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Application No.: US18178010Application Date: 2023-03-03
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Publication No.: US20240296009A1Publication Date: 2024-09-05
- Inventor: Syed Naseef , David Belz
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: G06F3/16
- IPC: G06F3/16 ; G06F13/362

Abstract:
Systems and methods for unifying multiple audio bus interfaces in an audio system are disclosed herein. In one aspect, an integrated circuit (IC) comprises a primary slave audio device comprising a first control circuit, and a dependent slave audio device comprising a second control circuit. The primary slave audio device and the dependent slave audio device are communicatively coupled via a slave status link, and the first control circuit and the second control circuit each configured to receive, from a master audio device, a mode instruction that indicates operation in one of a detach mode and a unify mode. The second control circuit is configured to, while operating in the detach mode, transmit a slave status to the master audio device via a second control lane, and, while operating in the unify mode, transmit the slave status to the primary slave audio device via the slave status link.
Public/Granted literature
- US12112091B2 Unifying multiple audio bus interfaces in an audio system Public/Granted day:2024-10-08
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