A wiring substrate includes a first wiring and a second wiring that intersects the first wiring. The first wiring is formed of a lower-layer wiring portion formed of a first conductive film and an upper-layer wiring portion formed of a second conductive film disposed on an upper layer side of the first conductive film via a first insulating film. A first contact hole that connects the lower-layer wiring portion and the upper-layer wiring portion is provided at a position where the first insulating film overlaps both the lower-layer wiring portion and the upper-layer wiring portion in the first insulating film. The second wiring is formed of a third conductive film disposed on an upper layer side of the second conductive film via second insulating films. The second insulating films have a larger film thickness than a film thickness of the first insulating film.