发明公开
- 专利标题： COOLING DEVICE
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申请号： US18614783申请日： 2024-03-25
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公开(公告)号： US20240332865A1公开(公告)日： 2024-10-03
- 发明人: Keisuke KAWATA , Toshihiko TOKESHI , Takehito TAMAOKA
- 申请人： Nidec Corporation
- 申请人地址： JP Kyoto
- 专利权人： Nidec Corporation
- 当前专利权人： Nidec Corporation
- 当前专利权人地址： JP Kyoto
- 优先权： JP 23055583 2023.03.30
- 主分类号： H01R13/6581
- IPC分类号： H01R13/6581 ; H05K7/20
摘要：
A cooling device includes a first component, a second component, and a shielding portion. The first component cools a heat generating component. The second component is different from the first component. The shielding portion performs shielding between the first component and the second component. The shielding portion includes a conductive material.
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