Invention Publication
- Patent Title: SYSTEM TO TRACK HOT-SECTION FLOWPATH COMPONENTS IN ASSEMBLED CONDITION USING HIGH TEMPERATURE MATERIAL MARKERS
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Application No.: US18710703Application Date: 2022-11-28
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Publication No.: US20240338543A1Publication Date: 2024-10-10
- Inventor: Sridhar Pakanati , Srinivasan Swaminathan , Arindam Ghosh , Ambarish Ghosh , Gayathri Honnenahalli Niranjana Murthy
- Applicant: General Electric Company , Indian Institute of Science
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company,Indian Institute of Science
- Current Assignee: General Electric Company,Indian Institute of Science
- Current Assignee Address: US NY Schenectady
- Priority: IN 2141055216 2021.11.29
- International Application: PCT/US2022/051083 2022.11.28
- Date entered country: 2024-05-16
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
There is provided markers, systems, and methods for creating and utilizing a marker containing identification information. The embodiments include an identifying marker comprised of high temperature material for tracking a component in a high temperature environment. The marker may be disposed on the component such that the marker is subject to high temperatures while affixed to the component. The marker may provide the ability to track a history of the component the marker is attached to for maintenance.
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