Invention Publication
- Patent Title: RESIN COMPOSITION AND APPLICATION THEREOF
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Application No.: US18757135Application Date: 2024-06-27
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Publication No.: US20240343852A1Publication Date: 2024-10-17
- Inventor: Min Chao CHUANG , Hailiang ZOU , Guiyun CHEN , Tao LIU
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN 2111676523.4 2021.12.31
- Main IPC: C08F290/06
- IPC: C08F290/06 ; C08F2/50 ; C08K5/37

Abstract:
Embodiments of this disclosure provide a resin composition and an disclosure thereof. The resin composition includes a polyurethane acrylate and a curing monomer, the curing monomer includes a compound containing a free radical polymerizable group and/or a compound containing a moisture curable group, and a weight-average molecular weight of the curing monomer is greater than or equal to 300.
Information query
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