Invention Publication
- Patent Title: COIL COMPONENT
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Application No.: US18583238Application Date: 2024-02-21
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Publication No.: US20240347265A1Publication Date: 2024-10-17
- Inventor: Soon Kwang Kwon , Tae Hyun Kim , Dong Hwan Lee , Byeong Cheol Moon , Boum Seock Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20230049952 2023.04.17
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/30

Abstract:
A coil component includes a body, a coil disposed within the body, a first insulating film covering a surface of the coil, where the first insulating film includes a first inorganic compound, and a second insulating film covering a surface of the first insulating film, where the second insulating film includes a second inorganic compound, wherein at least one of the first inorganic compound and the second inorganic compound include metal nitride.
Public/Granted literature
- US2148899A Pipetting machine Public/Granted day:1939-02-28
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