A radio frequency module that can improve heat dissipation properties and shielding properties is provided. In a radio frequency module, an electronic component has a main surface on an opposite side of a mounting board side and an outer peripheral surface. A resin layer covers at least a part of the outer peripheral surface of the electronic component. A metal electrode layer covers the main surface of the electronic component and a main surface of the resin layer on the opposite side of the mounting board side. In plan view from a thickness direction of a mounting board, an outer edge of the main surface of the electronic component is located on an inner side of an outer edge of the electronic component. The electronic component further has an inclined surface.