Invention Publication
- Patent Title: Thermal Interconnect for Implantable Blood Pump
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Application No.: US18673788Application Date: 2024-05-24
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Publication No.: US20240350791A1Publication Date: 2024-10-24
- Inventor: John Freddy Hansen
- Applicant: TC1 LLC
- Applicant Address: US MN St. Paul
- Assignee: TC1 LLC
- Current Assignee: TC1 LLC
- Current Assignee Address: US MN St. Paul
- The original application number of the division: US15976719 2018.05.10
- Main IPC: A61M60/148
- IPC: A61M60/148 ; A61M60/178 ; A61M60/216 ; A61M60/419 ; A61M60/422 ; A61M60/508

Abstract:
Systems, methods, and devices for improved cooling of an implantable blood pump employ a thermal conductor to conduct heat to blood flowing through the blood pump. A method includes drawing a flow of blood into a blood pump, passing the flow of blood through the blood pump such that heat flow is conducted to the flow of blood via the thermal conductor, and outputting the flow of blood from the blood pump.
Information query
IPC分类: