发明公开
- 专利标题： BUFFER CHIP, AND SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIPS
-
申请号： US18520228申请日： 2023-11-27
-
公开(公告)号： US20240361954A1公开(公告)日： 2024-10-31
- 发明人: Seong Ju LEE
- 申请人： SK hynix Inc.
- 申请人地址： KR Icheon-si Gyeonggi-do
- 专利权人： SK hynix Inc.
- 当前专利权人： SK hynix Inc.
- 当前专利权人地址： KR Icheon-si Gyeonggi-do
- 主分类号： G06F3/06
- IPC分类号： G06F3/06
摘要：
A buffer chip includes a chip select signal reception circuit for receiving one or more system chip select signals transmitted from a memory controller and a chip ID reception circuit for receiving chip ID information transmitted from the memory controller. The buffer chip also includes a chip select signal generation circuit that generates memory chip select signals by using the one or more system chip select signals and the chip ID information and a chip select signal transmission circuit that transmits the memory chip select signals to a plurality of memory chips.
信息查询
