An example semiconductor device package includes a semiconductor die including an environmental sensor on a device side surface mounted to a package substrate; a barrier comprising a polyimide dry film photoresist material surrounding the environmental sensor on the device side surface of the semiconductor die, the barrier having an interior side facing the environmental sensor and having an opposing exterior side; electrical connections between bond pads on the semiconductor die and leads on the package substrate; and mold compound covering portions of the semiconductor die and contacting the exterior side of the barrier, the mold compound covering the electrical connections and portions of the package substrate, with portions of the leads of the package substrate exposed from the mold compound to form terminals of the semiconductor device package, and the environmental sensor in a sensor cavity formed by the barrier and exposed from the mold compound.