The present disclosure is directed to systems and methods for cooling electronic devices. The system comprises a pump, a distribution manifold fluidly coupled to the pump, one or more capillary coolers fluidly coupled to the distribution manifold, one or more electronic devices coupled to the one or more capillary coolers, a vapor line fluidly coupled to the one or more capillary coolers, and a condenser comprising an inlet and an outlet, wherein the inlet is fluidly coupled to the vapor line and the outlet is fluidly coupled to the pump.