Heat pipes may be tailored for coefficient of thermal expansion (CTE) matching with heat-producing components, such as electronic components, in thermal contact therewith. Copper nanoparticles may be consolidated under mild conditions with a CTE modifier to form a copper composite defining a sealed outer shell of a heat pipe, which may contact a heat-producing component for promoting effective heat transfer and robust bonding between the two. A working fluid for promoting heat transfer may be present within an internal space defined within the sealed outer shell. The working fluid may transfer heat from a first location to a second location within the heat pipe. The heat may enter the heat pipe from a heat source contacting the first location, and the heat may exit the heat pipe at the second location through discharge to a suitable heat sink.