An adhesive based cable tie mount for attaching on a mounting surface and thereby mount cable ties to tie plurality of cable wires includes a top surface, a bottom surface, and a receiving cut-out portion formed between the top surface and the bottom surface. The top surface comprises a first end, a second end and a central portion for placing the cable wires. The top surface further has a predefined slanting towards a central portion. The bottom surface is configured to be attached with the mounting surface. A plurality of nubs of predefined dimension are disposed in a spaced apart manner on the bottom surface. The define a bond-line thickness between the bottom surface and sad mounting surface. The receiving cut-out portion is formed to accommodate the cable ties therein.