A semiconductor device and a method for making the same are provided. The method includes: providing a package including: a substrate having a front substrate surface and a back substrate surface, wherein the substrate includes a plurality of singulation areas separating the substrate into a plurality substrate units; a plurality of first electronic components mounted on the front substrate surface and within the plurality substrate units, respectively; and an encapsulant formed on the front substrate surface and encapsulating the plurality of first electronic components; forming a plurality of trenches at the plurality of singulation areas, respectively, wherein each of the plurality of trenches has a first portion extending through the encapsulant and a second portion extending through the encapsulant and the substrate; and forming an EMI shield to cover the encapsulant and lateral surfaces of the plurality of substrate units exposed by the second portions of the plurality of trenches.