A flip-chip mounting structure includes a first member including a first electrode pad, a bump formed on the first electrode pad, a second member including a second electrode pad, and a connection portion formed on the second electrode pad. The first member and the second member are flip-chip mounted, and the first electrode pad and the second electrode pad are electrically connected via the bump and the bonding portion. The bonding portion includes at least a first bonding portion formed in a region sandwiched between a top portion of the bump and the second electrode pad, and a second bonding portion formed in a region surrounding a periphery of the first bonding portion and a region surrounding at least a side surface of the bump. Each of the first bonding portion and the second bonding portion is made of a sintered body of a metal powder.