Invention Application
- Patent Title: STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES
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Application No.: US18794909Application Date: 2024-08-05
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Publication No.: US20240391758A1Publication Date: 2024-11-28
- Inventor: Ting-Ta YEN , Jeronimo SEGOVIA-FERNANDEZ , Ricky Alan JACKSON , Benjamin COOK
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: B81B7/00
- IPC: B81B7/00
Abstract:
In one example, a method comprises etching a vertical spring in a substrate, the vertical spring encompassing a device formed on a front side of the substrate. The method further comprises bonding a cap to the front side of the substrate, the cap disposed over the device and the vertical spring.
Information query
