Invention Application
- Patent Title: PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTOR PACKAGE, PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
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Application No.: US18789267Application Date: 2024-07-30
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Publication No.: US20240395551A1Publication Date: 2024-11-28
- Inventor: Keigo YAMAGUCHI , Kunihiko KODAMA
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2022-013385 20220131
- Main IPC: H01L21/027
- IPC: H01L21/027 ; G03F7/004 ; G03F7/038 ; G03F7/32 ; H01L21/02 ; H01L21/683
Abstract:
An object of the present invention is to provide a photosensitive composition capable of forming a pattern having a low coefficient of thermal expansion and a high glass transition temperature; a transfer film; a cured film; a semiconductor package; a pattern forming method; and a manufacturing method of a semiconductor package. The photosensitive composition of the present invention contains a compound A having a carboxy group, a compound β having a structure in which an amount of the carboxy group included in the compound A is decreased by exposure, and a filler.
Information query
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