PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTOR PACKAGE, PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Abstract:
An object of the present invention is to provide a photosensitive composition capable of forming a pattern having a low coefficient of thermal expansion and a high glass transition temperature; a transfer film; a cured film; a semiconductor package; a pattern forming method; and a manufacturing method of a semiconductor package. The photosensitive composition of the present invention contains a compound A having a carboxy group, a compound β having a structure in which an amount of the carboxy group included in the compound A is decreased by exposure, and a filler.
Information query
Patent Agency Ranking
0/0