A bonding apparatus for a semiconductor device including: a substrate state having a seating surface on which a first semiconductor device is placed; a head portion having a lower surface, the head portion configured to hold a second semiconductor device on the lower surface to face the first semiconductor device, the lower surface including a first portion having a first height from the seating surface and a second portion having a second height from the seating surface, the second height being greater than the first height, the lower surface being inclined at an angle with respect to the seating surface; and a transfer portion provided on the head portion to move the head portion, the transfer portion configured to press the head portion from the first portion to the second portion such that the first and second semiconductor devices are bonded to each other.