Invention Application
- Patent Title: HEAT PUMP CYCLE DEVICE
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Application No.: US18801214Application Date: 2024-08-12
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Publication No.: US20240401848A1Publication Date: 2024-12-05
- Inventor: Haruyuki NISHIJIMA , Yuichi KAMI , Hiroshi MIEDA
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya-city
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya-city
- Priority: JP2022-024884 20220221
- Main IPC: F25B30/02
- IPC: F25B30/02

Abstract:
A heat pump cycle device includes: a compressor; a branch portion; a heating unit configured to heat a heating object using one refrigerant branched at the branch portion as a heat source; a decompression unit configured to decompress the refrigerant flowing out of the heating unit; a bypass passage through which an another refrigerant branched at the branch portion flows; a regulating unit; and a joining portion. When a length of a suction-side flow path from an outlet port of the joining portion to a suction port of the compressor is defined as a suction-side flow path length L1, the suction-side flow path length L1 is equal to or longer than a relaxation distance Lv. The relaxation distance Lv is a flow length that is necessary for the refrigerant mixed in the joining portion to be made in a homogeneous state.
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